• Home
  • About Us
  • Technology
    • Chip on Board (CoB)
    • Wirebond Packaging (WB)
    • Flip-Chip Ball Grid Array (BGA, FCBGA)
    • Quad Flat No Lead (QFN)
    • Wafer Level Packaging (WLP)
    • System in Package (SiP)
    • Multi Chip Modules (MCM)
    • Heterogeneous Integration (2.5D and 3D)
  • Services
    • Design and Development Services
    • Production Services
      • Wire Bonding
      • Ball Placement/Bumping
      • Copper Pillar/TSV/UBM
      • Die Attach/Flip Chip
      • Molding/Encapsulation
      • Wafer Dicing/Thinning/Singulation
    • Testing Services
  • Contact

Teknopark İstanbul 9A-207
34906 Pendik/Istanbul Türkiye

+90 216 515 51 62
+90 216 515 51 39

info@tuyar.com.tr

  • Home
  • About Us
  • Technology
  • Services
  • Contact
© 2019 - TÜYAR Mikroelektronik San. ve Tic. A.Ş.
| Privacy Statement | Protection of Personal Data