Chip package design and optimization by multiphysics simulations:
Our design services help customers to develop and optimize chip package designs that meet their specific requirements. Multiphysics simulations allow it to predict the thermal, thermomechanical, and reliability performance of chip package designs before they are fabricated. This helps to reduce the risk of design failures and ensure that chip packages are reliable and meet customer performance requirements.
Development of assembly design kit (ADK) for easy customer access to technology:
ADK provides customers with all of the information they need to assemble their chip packages. This includes information on the chip package design, assembly materials, and assembly process. The ADK makes it easy for customers to design their chip packages in-house or to outsource the assembly process to a contract manufacturer.
Full chip packaging services, including:
- Wafer level fan-in/fan-out (WLFO) packages
- Flip-chip (FC) packages
- Ball grid array (BGA) packages
- Wirebond packages
- 2.5D and 3D packages
- Quad flat no-lead (QFN) packages
Single/Multi-step production services, including:
- Wafer grinding
- Wafer dicing
- Copper pillar (Cu pillar) fabrication
- Wire bonding