Cu stud, fine-pitch, and micro-Cu pillar bumping, enabled by precise UBM processing, facilitates high-performance die interconnection.
Cu stud, fine-pitch, and micro-Cu pillar bumping, enabled by precise UBM processing, facilitates high-performance die interconnection.
 |
Teknopark İstanbul 9A-207
34906 Pendik/Istanbul Türkiye
+90 216 515 51 62
+90 216 515 51 39
info@tuyar.com.tr