Versatility: Chip sizes: 0.5mm x 0.5mm to 30mm x 30mm and offer both face-down and face-up bonding options.

Bonding Techniques: Thermo-compression and adhesive bonding to match your specific application requirements.

Advanced Packaging Solutions: Chip on Flex/Film (CoF), Chip on Glass (CoG), Multi-chip Packaging (MCM, MCP), Flip Chip Bonding (face down), 2.5D and 3D IC Packaging (stacking), Wafer Level Packaging (FOWLP, W2W, C2W), and more.