Heterogeneous Integration involves combining different types of semiconductor components into a single package, leveraging both 2.5D and 3D integration techniques to achieve superior performance and efficiency.

Enhanced Performance: Integrates diverse components (logic, memory, RF) to optimize system performance.

Space Efficiency: 2.5D uses an interposer for side-by-side die placement, while 3D stacks dies vertically, significantly reducing footprint.

High Bandwidth: TSVs in 3D integration provide high-speed interconnects, essential for data-intensive applications.

Power Efficiency: Shorter interconnect paths reduce power consumption, critical for mobile and portable devices.

Application Areas: RF, EVs, Logic, Memory, High-performance Computers, Data Centers.