Toggle main menu visibility
Home
About Us
Technology
Chip on Board (CoB)
Wirebond Packaging (WB)
Flip-Chip Ball Grid Array (BGA, FCBGA)
Quad Flat No Lead (QFN)
Wafer Level Packaging (WLP)
System in Package (SiP)
Multi Chip Modules (MCM)
Heterogeneous Integration (2.5D and 3D)
Services
Design and Development Services
Production Services
Wire Bonding
Ball Placement/Bumping
Copper Pillar/TSV/UBM
Die Attach/Flip Chip
Molding/Encapsulation
Wafer Dicing/Thinning/Singulation
Testing Services
Contact
Contact
Contact Form
Name Surname
Telephone Number
E-mail Address
Message
55810
Send
Başarılı!
Mesajınız Alınmıştır, En Kısa Sürede Size Geri Dönüş Yapılacaktır.
Hata!
Mesajınız gönderilirken hata oluştu. Lütfen tekrar deneyin.
