Jet Printing Ball Grid Array (BGA)

Placing Accuracy: 3µm @3sigma

Solder ball diameter: 40um – 760 µm

Alloy options: SnAgCu, SnAg, SnPb, AuSn, InSn, SnBi

Diverse Applications: BGA/PCB/cLCC balling, rework/repair, wafer bumping, and advanced packaging, including optoelectronics, MEMS, and HF devices.