Custom die attach solutions and interconnection for chip on board (CoB) or leadframe applications.

Supports wire materials including aluminum (Al), gold (Au), copper (Cu), platinum (Pt), palladium (Pd), aluminum-copper alloy (AlCu), and palladium-clad copper (PCC).

Ribbon bonding compatible with aluminum (Al) materials.

Wire diameter range includes ultra-fine and fine wire from 17.5 µm to 75 µm and heavy wire from 100 µm to 600 µm.

Capable of gold stud bumping for interconnects.