Chip on Board (CoB) technology mounts bare semiconductor dies directly onto a PCB, improving thermal performance and reducing package size.

Compact Design: Eliminates the need for individual chip packages, saving space.

Superior Thermal Management: Direct mounting on PCB enhances heat dissipation.

Cost-Effective: Reduces packaging costs by simplifying the assembly process.

High Density: Allows for higher component density on the PCB, ideal for space-constrained applications.