System in Package (SiP) integrates multiple ICs and passive components into a single module, enabling complex, multifunctional systems in compact packages.

High Integration: Combines processors, memory, RF, and sensors in one package, enhancing functionality.

Compact Size: Reduces board space, ideal for space-constrained applications like wearables.

Improved Performance: Enhanced signal integrity and reduced power consumption through shorter interconnects.

Design Flexibility: Supports various semiconductor technologies, allowing for versatile system designs.