Multiple (patterned and non patterned) wafer size processing and Package singulation

Wafer types: Silicon (Si), Gallium Nitride (GaN), Silicon Carbide (SiC), Sapphire (Al₂O₃), Quartz (SiO₂), Gallium Arsenide (GaAs), Indium Phosphide (InP), Germanium (Ge), Silicon on Insulator (SOI), Aluminum Nitride (AlN), Zinc Oxide (ZnO)