Wafer Level Packaging (WLP) is an advanced packaging technology where the entire packaging process, including testing, is performed at the wafer level before the wafer is diced into individual chips. This method includes both Fan-In WLP (FIWLP) and Fan-Out WLP (FOWLP) technologies. FIWLP keeps all connections within the chip area, making it highly efficient for small, integrated circuits, while FOWLP extends connections beyond the chip footprint, allowing for higher I/O density and better performance.

Miniaturization: Achieves very small and thin packages, perfect for portable devices.

Enhanced Performance: Reduces parasitic effects, improving electrical performance.

Cost Efficiency: Streamlines manufacturing by packaging and testing at the wafer level.

High Integration Density: Fan-Out WLP (FOWLP) enables higher component density and better performance.

Versatility: Fan-In WLP (FIWLP) integrates all connections within the chip area, suitable for highly integrated and cost-sensitive applications.